Projects
已投项目
人工智能 - 面部识别,智能互联网挖掘
区块链 - 葡萄酒供应链中的追踪和防伪
量子计算 - 固态硬盘,正在洽谈超冷却处理技术
网络安全 -
特殊机器人 -
特殊新材料 - 正在洽谈防尘、超防水技术
新型OTC保健药物 -
Copyright © 2016, Bund Capital, LLC. Bund®, Bund logo®, fund π® and fund ω® are all trademarks of Bund Capital, LLC. All Rights Reserved. Any product name of another company or organization mentioned is the property or trademark of its respective owner.